■ FIGURE 9. Paste applied.
• Bump temperature to 400 degrees until just
has a lot of experience in electronics manufacturing and
has "cooked up" many PCBs in his toaster oven, so I went
with his recipe for baking:
• Put boards in oven and set to 200 degrees for three
When the boards are done, turn the oven off and
very gently open the door. Let the boards cool for
about 30 seconds before — also very gently — pulling
the rack out to complete the cooling. If you get too
aggressive with the rack before the solder has cooled,
you could find that parts shift, possibly ruining your
hard work. Figure 11 shows my board with just a
couple little solder balls that are easily removed with a
John explained that the first step helps drive any
moisture out of the parts and helps big components
like the regulator get some heat into them. The second
stage is actually the first part of the re-flow profile. Finally,
the last stage heats the PCB and solder enough for re-flow.
John warned me not to leave the boards in the oven very
long after re-flow; if the PCBs get too hot they can scorch
and de-laminate. Using his recipe, I never had this problem
and all of the boards turned out really great.
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